LPKF Microline Series UV-YAG Laser Drill
The LPKF Microline 600 is an advanced laser system that has helped Stevenage Circuits stay at the forefront of HDI capability in the PCB industry since its installation in 2003. Originally acquired for its high precision cutting and structuring abilities, the Microline 600 also excels in buried via / blind via drilling.
The Microline 600 is predominently used for fast and accurate pre-forming of our pre-pregs, laminates, and flexible coverlays used in the manufacture of Flexible and Flexi-Rigid products, but it doesn't end there! The high speed precision enables Stevenage Circuits to contour / profile all manner of materials in ways that previously would have been impossible, solder resist patterns can be laser ablated prior to finishing, and even small areas of circuitry can be directly structured.
The people at LPKF have kindly allowed us to provide a document entitled 'PCB Laser technology for rigid and flex HDI - via formation, structuring, routing' which includes valuable technical information. Please find a copy of the document here:
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To find out more about the technical capabilities that the LPKF Microline series provides, please see the brochure below:
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